photo mask China

photomask pellicleLanguage reticle pellicle
CN EN
glass waferCN
SEMICONDUCTOR CHANGES LIFE
BEAUTIFUL BIG COLOR RING IN OUR CITY

  • 8+

    8 Year High-tech Enterprise

  • 20+

    20 Key Technical Personnel

  • 30+

    Cooperation with Well-known Enterprises

  • 98%

    Customer Satisfaction Feedback

About LANLI
 

Changzhou LANLI was founded in October 2014. It has established a cooperative R & D relationship with School of Materials of Changzhou University and Shaanxi University of Science and Technology in 2015, focusing on the design, development and sales of semiconductor clean packaging protection materials and micro-electronic equipment. The company has passed the CNAS quality management system certification, environmental management system certification and occupational health and safety management system certification...

photomask box
reticle China photomask China
Wafers and Carriers Micro Device Gel Box & Sticky Box Antistatic PP Horizontal Wafer Canister Ultra Clean PP Wafer Shipping Box Chip Tray & Waffle Pack High Temperature Wafer Baking Cassette Framed Wafer Metal Cassette ABS Wafer Cassette Prime Wafer and Test Wafer Synthetic Quartz Wafer Sapphire Wafer Glass Wafer LLW PFA Wafer Carrier - 8” B LLW PFA Wafer Carrier - 8” A LLW PFA Wafer Carrier - 6” LLW PFA Wafer Carrier - 4”

Our products

Wafers and Carriers Photomasks and Carriers Equipment and Parts Electronic Materials
Photomasks and Carriers Photomask/Reticle Blanks Photomask/Reticle Supply LLW Photomask Pick - Y Type LLW Photomask Pick - I Type LLW Photomask Pick - F Type LLW Photomask Pellicle LLW Reticle Multiplate Boxes LLW Photomask/Reticle Boxes
Equipment and Parts LLW-MTB Dicing machine Bonding Capillaries(gold, copper, silver alloy wire bonding) Wafer Dicing Blades Die Bonder and Die Sorting Equipment Semiconductor Equipment Ceramic Parts 2000mm Diameter Super Large Glue/Developer(for defence) Table Top Bonder(F&S Bondtec replacement) Parts for PVD Equipment Parts for CVD Equipment Parts for ETCH Equipment Nikon/Canon Stepper(lithography machine) Light Source Diebond/Wirebond AOI Equipment Chip Test Handler(Cohu Ismeca replacement) Photomask/Reticle DD/DB/Starlight Inspection(KLA351 replacement ) Bare and Framed Wafer AOI Inspection(Camtek replacement) Semiconductor Packaging Reflow(BTU Pyramax replacement) Wafer/Panel/Substrate Ball Planting Machine(Athlete replacement) Wafer Box Cleaner(Brooks replacement) LLW MPM2000 Pellicle Mounter LLW MPM2000 Pellicle Mounter
Electronic Materials BGA/CSP Packaging Tin Ball Copper and Alloy Heatsink for Chip and Defence Dk 20-130 Microwave Substrate customized Antenna Radar Absorbing Patch(ARC/Du Pont/Laird replacement) High Power, High Temperature Mica and PTFE Capacitors(CDE replacement) ETFE Film for Semiconductor Packaging Application High Thermal Conductivity Microwave Laminate for Power Amplifier(TC350 replacement) PTFE+Ceramic RF Substrate Dk up to 16(Rogers replacement) Ceramic+PPO RF Substrate Dk up to 20 for Defence IC Substrate for CSP/FC-CSP/SiP/PBGA Dk 24 Microwave Ceramic Substrate Material for Defence MEMS Wafer TGV(Through Glass Via) Glass Substrate for Bonding Aluminum Wire,Copper Wire,Gold Wire,Gold Ribb for Bonding

quartz wafer+86-138 0150 1721（Mr.Pan）

mask blankinfo@semiconductor-tools.com

reticle boxNo.120 Hanjiang Road,Xinbei District, Changzhou,Jiangsu,China
(Zip Code:213022)

@2021 Copyright: Lanli Microelectronic Materials (Changzhou) Co., Ltd.